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Texas Instruments LMP90077MHX/NOPB
Manufacturer # :LMP90077MHX/NOPB
Manufacturer :Texas Instruments
Dasenic # :LMP90077MHX/NOPB-DS
Datasheet : LMP90077MHX/NOPB Datasheet
Customer # :
Description : IC AFE 1 CHAN 16BIT 28HTSSOP
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In Stock: 2367
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 19.728
Total :$ 19.73
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Payment :
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LMP90077MHX/NOPB information
Texas Instruments LMP90077MHX/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog Front End (AFE)
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Number of Channels:1
- Supplier Device Package:28-HTSSOP
- Power ( Watts):-
- Number of Bits:16
- Voltage - Supply, Analog:2.85V ~ 5.5V
- Voltage - Supply, Digital:2.7V ~ 5.5V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMP90077MHX/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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