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Texas Instruments LMC6762AIM
Manufacturer # :LMC6762AIM
Manufacturer :Texas Instruments
Dasenic # :LMC6762AIM-DS
Datasheet : LMC6762AIM Datasheet
Customer # :
Description : IC COMPARATOR 2 GEN PUR 8SOIC
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In Stock: 1690
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.815
Total :$ 0.81
Delivery :
Payment :
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LMC6762AIM information
Texas Instruments LMC6762AIM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Comparators
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Type:General Purpose
- Output Type:Push-Pull, Rail-to-Rail
- Supplier Device Package:8-SOIC
- Number of Elements:2
- Voltage - Supply, Single/ Dual (±):2.7V ~ 15V, ±1.35V ~ 7.5V
- Voltage - Input Offset ( Max):5mV @ 5V
- Current - Input Bias ( Max):0.04pA @ 5V
- Current - Output ( Typ):30mA
- Current - Quiescent ( Max):20µA
- C M R R, P S R R ( Typ):75dB CMRR, 80dB PSRR
- Propagation Delay ( Max):10µs
- Base Product Number:LMC6762
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMC6762AIM provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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