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Rochester Electronics LM48822TLX/NOPB

LM48822 GND-REF ULTRA HIGH PSRR
part number has RoHS
Manufacturer # :LM48822TLX/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LM48822TLX/NOPB-DS
Customer # :
Description : LM48822 GND-REF ULTRA HIGH PSRR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.2240$ 1.22
25+$ 1.1970$ 29.93
100+$ 1.1520$ 115.2
500+$ 1.0980$ 549
1000+$ 1.0440$ 1044
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.224
Total :$ 1.22
Delivery :
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Payment :
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LM48822TLX/NOPB information

  • Rochester Electronics LM48822TLX/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Depop, Differential Inputs, I²C, Mute, Shutdown, Volume Control
  • Mounting Type:Surface Mount
  • Package / Case:16-WFBGA, DSBGA
  • Type:Class AB
  • Output Type:Headphones, 2-Channel (Stereo)
  • Supplier Device Package:16-DSBGA
  • Voltage - Supply:2.4V ~ 5.5V
  • Max Output Power x Channels @ Load:40mW x 2 @ 32Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM48822TLX/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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