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Texas Instruments LM386N-3/NOPB

IC AMP CLASS AB MONO 700MW 8DIP
part number has RoHS
Manufacturer # :LM386N-3/NOPB
Manufacturer :Texas Instruments
Dasenic # :LM386N-3/NOPB-DS
Customer # :
Description : IC AMP CLASS AB MONO 700MW 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
40+$ 0.4685$ 18.74
120+$ 0.4163$ 49.96
520+$ 0.4042$ 210.18
1000+$ 0.3825$ 382.5
2520+$ 0.3662$ 922.82
In Stock: 8634
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4685
Total :$ 0.47
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LM386N-3/NOPB information

  • Texas Instruments LM386N-3/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Features:-
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Type:Class AB
  • Output Type:1-Channel (Mono)
  • Supplier Device Package:8-PDIP
  • Voltage - Supply:4V ~ 12V
  • Max Output Power x Channels @ Load:700mW x 1 @ 8Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM386N-3/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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