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Texas Instruments LM335M
Manufacturer # :LM335M
Manufacturer :Texas Instruments
Dasenic # :LM335M-DS
Datasheet : LM335M Datasheet
Customer # :
Description : SENSOR ANALOG -40C-100C 8SOIC
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In Stock: 12000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7317
Total :$ 0.73
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LM335M information
Texas Instruments LM335M technical specifications, attributes, parameters.
- Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 100°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Output Type:Analog Voltage
- Supplier Device Package:8-SOIC
- Resolution:10mV/°K
- Voltage - Supply:-
- Sensor Type:Analog, Local
- Test Condition:25°C (-40°C ~ 100°C)
- Sensing Temperature - Local:-40°C ~ 100°C
- Sensing Temperature - Remote:-
- Accuracy - Highest ( Lowest):±6°C (±9°C)
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM335M provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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