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Texas Instruments F2800135PMR
Manufacturer # :F2800135PMR
Manufacturer :Texas Instruments
Dasenic # :F2800135PMR-DS
Datasheet : F2800135PMR Datasheet
Customer # :
Description : C2000™ 32-bit MCU with 120 MHz, 128-KB flash, FPU and TMU
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In Stock: 4908
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 3.402
Total :$ 3.40
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F2800135PMR information
Texas Instruments F2800135PMR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Package / Case:64-LQFP
- Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
- Speed:120MHz
- Connectivity:CANbus, FIFO, I²C, SCI, SPI, UART/USART
- Series:C2000™
- Operating Temperature:-40°C ~ 125°C (TA)
- Core Processor:C28x
- R A M Size:18K x 16
- Numberof I/ O:38
- Program Memory Type:Flash
- Core Size:32-Bit
- Data Converters:A/D 21x12b SAR; D/A 8x12b
- Oscillator Type:External, Internal
- Program Memory Size:128KB (64K x 16)
- Voltage- Supply( Vcc/ Vdd):2.8V ~ 3.63V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
F2800135PMR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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