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Texas Instruments ESD122DMXR
Manufacturer # :ESD122DMXR
Manufacturer :Texas Instruments
Dasenic # :ESD122DMXR-DS
Datasheet : ESD122DMXR Datasheet
Customer # :
Description : TVS DIODE 3.6VWM 8.4VC 3X2SON 3-XFDFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 30571
MOQ :1 PCS
Packaging :3-XFDFN
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3753
Total :$ 0.38
Delivery :
Payment :
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ESD122DMXR information
Texas Instruments ESD122DMXR technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/TVS - Diodes
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:3-XFDFN
- Type:Zener
- Capacitance @ Frequency:0.2pF @ 1MHz
- Supplier Device Package:3-X2SON (1x0.6)
- Unidirectional Channels:-
- Voltage - Reverse Standoff ( Typ):3.6V (Max)
- Voltage - Breakdown ( Min):5.1V
- Voltage - Clamping ( Max) @ Ipp:8.4V (Typ)
- Current - Peak Pulse (10/1000µs):2.5A (8/20µs)
- Power - Peak Pulse:20W
- Power Line Protection:No
- Bidirectional Channels:2
- Applications:HDMI, USB
ESD122DMXR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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