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Texas Instruments DRA722AHGABCQ1
Manufacturer # :DRA722AHGABCQ1
Manufacturer :Texas Instruments
Dasenic # :DRA722AHGABCQ1-DS
Datasheet : DRA722AHGABCQ1 Datasheet
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Description : 800 MHz Arm Cortex-A15 SoC processor with graphics and DSP for automotive infotainment & cluster
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In Stock: 789
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 82.56
Total :$ 82.56
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DRA722AHGABCQ1 information
Texas Instruments DRA722AHGABCQ1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Active
- Package / Case:760-BFBGA, FCBGA
- Speed:750MHz
- Co- Processors/ D S P:ARM® Cortex®-M4, BB2D, C66x, GPU, IVA
- Ethernet:10/100/1000Mbps (1), 1Gbps (2)
- S A T A:SATA
- U S B:USB 2.0 (2), USB 3.0 (1)
- Series:DRA72x
- Operating Temperature:-40°C ~ 125°C (TJ)
- Core Processor:ARM® Cortex®-A15
- Voltage- I/ O:1.35V, 1.5V, 1.8V, 3.3V
- R A M Controllers:DDR3, DDR3L
- Security Features:Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
- Graphics Acceleration:Yes
- Numberof Cores/ Bus Width:1 Core, 32-Bit
- Display& Interface Controllers:HDMI, LCD
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRA722AHGABCQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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