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Texas Instruments DAC12DL3200ALJ

12-bit, low-latency, dual 3.2-GSPS or single 6.4-GSPS, RF-sampling DAC (LVDS interface)
part number has RoHS
Manufacturer # :DAC12DL3200ALJ
Manufacturer :Texas Instruments
Dasenic # :DAC12DL3200ALJ-DS
Customer # :
Description : 12-bit, low-latency, dual 3.2-GSPS or single 6.4-GSPS, RF-sampling DAC (LVDS interface)
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5985.5000$ 5985.5
In Stock: 1503
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5985.5
Total :$ 5985.50
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  • Texas Instruments DAC12DL3200ALJ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Digital to Analog Converters (DAC)
  • Product Status:Active
  • Package / Case:256-BGA, FCBGA
  • Supplier Device Package:256-FCBGA (17x17)
  • Operating Temperature:-40°C ~ 85°C
  • Data Interface:LVDS - Parallel
  • Numberof Bits:12
  • Voltage- Supply Analog:0.95V ~ 1.05V, ±1.71V ~ 1.89V
  • Voltage- Supply Digital:0.95V ~ 1.05V, ±1.71V ~ 1.89V
  • Reference Type:Internal
  • Output Type:Voltage - Unbuffered
  • I N L/ D N L( L S B):±0.9LSB, ±0.6LSB
  • Differential Output:No
  • Numberof D/ A Converters:2
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DAC12DL3200ALJ provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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