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Texas Instruments DAC121S101 MDP
Manufacturer # :DAC121S101 MDP
Manufacturer :Texas Instruments
Dasenic # :DAC121S101 MDP-DS
Datasheet : DAC121S101 MDP Datasheet
Customer # :
Description : IC DAC 12BIT V-OUT DIE
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In Stock: 10
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
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Texas Instruments DAC121S101 MDP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Digital to Analog Converters (DAC)
- Product Status:Active
- Package / Case:Die
- Supplier Device Package:Die
- Architecture:String DAC
- Operating Temperature:-40°C ~ 105°C
- Data Interface:3-Wire Serial, DSP, Microwire, QSPI, SPI
- Numberof Bits:12
- Voltage- Supply Analog:2.7V ~ 5.5V
- Voltage- Supply Digital:2.7V ~ 5.5V
- Output Type:Voltage - Buffered
- I N L/ D N L( L S B):±8 (Max), ±0.5/+1 (Max)
- Settling Time:8µs
- Differential Output:No
- Numberof D/ A Converters:1
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DAC121S101 MDP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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