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Texas Instruments CDCLVD2108RGZR
IC CLK BUFFER 1:8 800MHZ 48VQFN
Manufacturer # :CDCLVD2108RGZR
Manufacturer :Texas Instruments
Dasenic # :CDCLVD2108RGZR-DS
Datasheet :
CDCLVD2108RGZR Datasheet
CDCLVD2108RGZR DatasheetCustomer # :
Description : IC CLK BUFFER 1:8 800MHZ 48VQFN
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| Quantity | Unit Price | Total |
| 10+ | $ 25.8023 | $ 258.02 |
| 2500+ | $ 14.3346 | $ 35836.5 |
In Stock: 732
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.8023
Total :$ 25.80
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CDCLVD2108RGZR information
Texas Instruments CDCLVD2108RGZR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:48-VFQFN Exposed Pad
- Type:Fanout Buffer (Distribution)
- Supplier Device Package:48-VQFN (7x7)
- Frequency - Max:800 MHz
- Number of Circuits:2
- Output:LVDS
- Voltage - Supply:2.375V ~ 2.625V
- Input:LVCMOS, LVDS, LVPECL
- Ratio - Input: Output:1:8
- Differential - Input: Output:Yes/Yes
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDCLVD2108RGZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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