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Rochester Electronics CD74AC139M
IC DECODER/DEMUX 1X2:4 16SOIC
Manufacturer # :CD74AC139M
Manufacturer :Rochester Electronics
Dasenic # :CD74AC139M-DS
Datasheet :
CD74AC139M Datasheet
CD74AC139M DatasheetCustomer # :
Description : IC DECODER/DEMUX 1X2:4 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.5650 | $ 0.57 |
| 25+ | $ 0.5537 | $ 13.84 |
| 100+ | $ 0.5311 | $ 53.11 |
| 500+ | $ 0.5085 | $ 254.25 |
| 1000+ | $ 0.4802 | $ 480.2 |
In Stock: 12190
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.565
Total :$ 0.56
Delivery :
Payment :
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CD74AC139M information
Rochester Electronics CD74AC139M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Type:Decoder/Demultiplexer
- Supplier Device Package:16-SOIC
- Voltage - Supply:1.5V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:24mA, 24mA
- Circuit:1 x 2:4
- Independent Circuits:2
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74AC139M provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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