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Texas Instruments CD40103BE
Manufacturer # :CD40103BE
Manufacturer :Texas Instruments
Dasenic # :CD40103BE-DS
Datasheet : CD40103BE Datasheet
Customer # :
Description : IC SYNC DOWN COUNTER 8STG 16-DIP
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In Stock: 33881
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2547
Total :$ 0.25
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CD40103BE information
Texas Instruments CD40103BE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Counters, Dividers
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Direction:Down
- Supplier Device Package:16-PDIP
- Number of Elements:1
- Voltage - Supply:3 V ~ 18 V
- Logic Type:Binary Counter
- Number of Bits per Element:8
- Reset:Asynchronous
- Timing:Synchronous
- Count Rate:2.4 MHz
- Trigger Type:Positive Edge
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD40103BE provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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