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Texas Instruments CC2640R2FRHBR
Manufacturer # :CC2640R2FRHBR
Manufacturer :Texas Instruments
Dasenic # :CC2640R2FRHBR-DS
Datasheet : CC2640R2FRHBR Datasheet
Customer # :
Description : IC RF TXRX+MCU BLUETOOTH 32VFQFN
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In Stock: 39087
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 2.4939
Total :$ 2.49
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CC2640R2FRHBR information
Texas Instruments CC2640R2FRHBR technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad
- Frequency:2.4GHz
- Type:TxRx + MCU
- Sensitivity:-103dBm
- Supplier Device Package:32-VQFN (5x5)
- Data Rate ( Max):2Mbps
- Memory Size:128kB Flash, 28kB SRAM
- Voltage - Supply:1.8V ~ 3.8V
- Power - Output:5dBm
- Protocol:Bluetooth v5.0
- Serial Interfaces:I²C, I²S, SPI, UART
- R F Family/ Standard:Bluetooth
- Current - Receiving:5.9mA
- Modulation:GFSK
- G P I O:15
- Current - Transmitting:9.1mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC2640R2FRHBR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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