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Texas Instruments AM2632CNEFHAZCZR
Manufacturer # :AM2632CNEFHAZCZR
Manufacturer :Texas Instruments
Dasenic # :AM2632CNEFHAZCZR-DS
Datasheet : AM2632CNEFHAZCZR Datasheet
Customer # :
Description : Dual-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security
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In Stock: 6000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 13.1592
Total :$ 13.16
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AM2632CNEFHAZCZR information
Texas Instruments AM2632CNEFHAZCZR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Package / Case:324-LFBGA
- Peripherals:AES, DMA, POR, PWM, SHA, TRNG, WDT
- Speed:400MHz
- Connectivity:CANbus, Ethernet, I²C, MMC/SDIO, QSPI, SPI, UART/USART
- Series:Sitara™
- Operating Temperature:-40°C ~ 105°C (TJ)
- Core Processor:Arm® Cortex®-R5F
- R A M Size:2M x 8
- Numberof I/ O:140
- Program Memory Type:Tightly Coupled Memory (TCM)
- Core Size:32-Bit Dual-Core
- Data Converters:A/D 6x12b SAR; D/A 1x12b
- Oscillator Type:Internal
- Program Memory Size:256KB (256K x 8)
- Voltage- Supply( Vcc/ Vdd):1.14V ~ 1.26V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AM2632CNEFHAZCZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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