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Texas Instruments 6PAIC3109TRHBRQ1
Manufacturer # :6PAIC3109TRHBRQ1
Manufacturer :Texas Instruments
Dasenic # :6PAIC3109TRHBRQ1-DS
Datasheet : 6PAIC3109TRHBRQ1 Datasheet
Customer # :
Description : AUTOMOTIVE LOW-POWER 96KHZ MONO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10880
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.0223
Total :$ 2.02
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6PAIC3109TRHBRQ1 information
Texas Instruments 6PAIC3109TRHBRQ1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad
- Type:Audio
- Supplier Device Package:32-VQFN (5x5)
- Resolution ( Bits):16 b, 20 b, 24 b, 32 b
- Data Interface:I²C, I²S
- Voltage - Supply, Analog:2.7V ~ 3.6V
- Voltage - Supply, Digital:1.1V ~ 3.6V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:Yes
- S/ N Ratio, A D Cs / D A Cs (db) Typ:92 / 102
- Dynamic Range, A D Cs / D A Cs (db) Typ:93 / 97
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
6PAIC3109TRHBRQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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