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STMicroelectronics L6360
Manufacturer # :L6360
Manufacturer :STMicroelectronics
Dasenic # :L6360-DS
Datasheet : L6360 Datasheet
Customer # :
Description : IC TRANSCEIVER 1/1 26VFDFPN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9621
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.8163
Total :$ 2.82
Delivery :
Payment :
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STMicroelectronics L6360 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-25°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:26-VFQFN Exposed Pad
- Type:Transceiver
- Supplier Device Package:-
- Voltage - Supply:18V ~ 32.5V
- Protocol:PHY2
- Number of Drivers/ Receivers:1/1
- Duplex:-
- Receiver Hysteresis:-
- Data Rate:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
L6360 provided by STMicroelectronics
Founded in 1987, STMicroelectronics(NYSE: STM) is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life.
ST is a leading supplier of a wide range of semiconductor products and solutions, including microcontrollers, digital and analog integrated circuits, power management devices, MEMS sensors, imaging and audio solutions, and wireless connectivity solutions.Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology.
We work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world.
ST is a multinational company headquartered in Geneva, Switzerland, with operations in over 35 countries.
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