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Rochester Electronics ZLF645E0H2064G
Manufacturer # :ZLF645E0H2064G
Manufacturer :Rochester Electronics
Dasenic # :ZLF645E0H2064G-DS
Datasheet : ZLF645E0H2064G Datasheet
Customer # :
Description : IC MCU 8BIT 64KB FLASH 20SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 25409
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.62
Total :$ 1.62
Delivery :
Payment :
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ZLF645E0H2064G information
Rochester Electronics ZLF645E0H2064G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package:20-SSOP
- Peripherals:Brown-out Detect/Reset, HLVD, POR, WDT
- Number of I/ O:16
- Speed:8MHz
- E E P R O M Size:-
- Core Processor:Z8 LXMC
- R A M Size:1K x 8
- Program Memory Type:Flash
- Core Size:8-Bit
- Connectivity:UART/USART
- Program Memory Size:64KB (64K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.9V ~ 3.6V
- Data Converters:-
- Oscillator Type:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ZLF645E0H2064G provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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