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1 : $1.5660
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Rochester Electronics UPG2255T6N-E2-A
NARROW BAND LOW POWER AMPLIFIER
Manufacturer # :UPG2255T6N-E2-A
Manufacturer :Rochester Electronics
Dasenic # :UPG2255T6N-E2-A-DS
Datasheet :
UPG2255T6N-E2-A Datasheet
UPG2255T6N-E2-A DatasheetCustomer # :
Description : NARROW BAND LOW POWER AMPLIFIER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.5660 | $ 1.57 |
| 25+ | $ 1.5390 | $ 38.48 |
| 100+ | $ 1.4760 | $ 147.6 |
| 500+ | $ 1.4130 | $ 706.5 |
| 1000+ | $ 1.3320 | $ 1332 |
In Stock: 21600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.566
Total :$ 1.57
Delivery :
Payment :
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UPG2255T6N-E2-A information
Rochester Electronics UPG2255T6N-E2-A technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Amplifiers
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:6-XFDFN Exposed Pad
- Frequency:1.88GHz ~ 1.93GHz
- Current - Supply:200mA
- Supplier Device Package:6-TSON (1.5x1.5)
- Voltage - Supply:1.5V ~ 3.5V
- Gain:60dB
- Noise Figure:-
- P1d B:25dBm
- R F Type:General Purpose
- Test Frequency:1.88GHz ~ 1.93GHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
UPG2255T6N-E2-A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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