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Rochester Electronics UCC27323P

IC GATE DRVR LOW-SIDE 8DIP
part number has RoHS
Manufacturer # :UCC27323P
Manufacturer :Rochester Electronics
Dasenic # :UCC27323P-DS
Customer # :
Description : IC GATE DRVR LOW-SIDE 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.3860$ 1.39
10+$ 0.8604$ 8.6
100+$ 0.8145$ 81.45
250+$ 0.7659$ 191.48
500+$ 0.7362$ 368.1
In Stock: 5379
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.386
Total :$ 1.39
Delivery :
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Payment :
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UCC27323P information

  • Rochester Electronics UCC27323P technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Input Type:Inverting
  • Supplier Device Package:8-PDIP
  • Voltage - Supply:4.5V ~ 15V
  • Channel Type:Independent
  • Driven Configuration:Low-Side
  • Number of Drivers:2
  • Gate Type:N-Channel, P-Channel MOSFET
  • Logic Voltage - V I L, V I H:1V, 2V
  • Current - Peak Output ( Source, Sink):4A, 4A
  • High Side Voltage - Max ( Bootstrap):-
  • Rise / Fall Time ( Typ):20ns, 15ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
UCC27323P provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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