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Rochester Electronics TSB43AB22PDT
IC CONTROLLER LINK LAYER 128TQFP
Manufacturer # :TSB43AB22PDT
Manufacturer :Rochester Electronics
Dasenic # :TSB43AB22PDT-DS
Datasheet :
TSB43AB22PDT Datasheet
TSB43AB22PDT DatasheetCustomer # :
Description : IC CONTROLLER LINK LAYER 128TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.4360 | $ 5.44 |
| 25+ | $ 5.3280 | $ 133.2 |
| 100+ | $ 5.1120 | $ 511.2 |
| 500+ | $ 4.8960 | $ 2448 |
| 1000+ | $ 4.6170 | $ 4617 |
In Stock: 28045
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.436
Total :$ 5.44
Delivery :
Payment :
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TSB43AB22PDT information
Rochester Electronics TSB43AB22PDT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Controllers
- Product Status:Not For New Designs
- Operating Temperature:0°C ~ 70°C
- Package / Case:128-TQFP
- Current - Supply:-
- Interface:PCI
- Supplier Device Package:128-TQFP (14x14)
- Standards:IEEE 1394-1995, 1394a-2000, OHCI, Firewire™, i.Link™
- Voltage - Supply:3V ~ 3.6V
- Protocol:IEEE 1394
- Function:Physical Layer Controller
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TSB43AB22PDT provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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