Name: TSB12LV01BIPZTEP
Brand: Rochester Electronics
SKU: DS-5699249
Price: 12.654 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $12.6540

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Rochester Electronics TSB12LV01BIPZTEP

IC LINK LAYER 3.3V HP 100-TQFP

Manufacturer # :TSB12LV01BIPZTEP

Manufacturer :Rochester Electronics

Dasenic # :TSB12LV01BIPZTEP-DS

Datasheet :

TSB12LV01BIPZTEP Datasheet

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Description : IC LINK LAYER 3.3V HP 100-TQFP

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
1+	$ 12.6540	$ 12.65
25+	$ 12.4020	$ 310.05
100+	$ 11.8980	$ 1189.8
500+	$ 11.3850	$ 5692.5
1000+	$ 10.7550	$ 10755

In Stock: 1595

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 12.654

Total :$ 12.65

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TSB12LV01BIPZTEP information

Rochester Electronics TSB12LV01BIPZTEP technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Controllers
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C
Package / Case:100-TQFP
Current - Supply:-
Interface:Parallel
Supplier Device Package:100-TQFP (14x14)
Standards:IEEE 1394-1995, 1394a-2000
Voltage - Supply:3.3V, 5V
Protocol:IEEE 1394
Function:Link Layer Controller
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Rochester Electronics TSB12LV01BIPZTEP
Datasheet:
TSB12LV01BIPZTEP,

Rochester Electronics TSB12LV01BIPZTEP Environmental and export classification status description
The Texas Instruments TSB12LV01BIPZTEP is a high-performance, low-power, single-chip, 1394a-2000 OHCILink and PHY. It integrates the Link Layer Controller (LLC) with the physical layer as defined in IEEE Std 1394-2000 to provide a cost-effective, compact, and robust solution for connecting digital multimedia appliances to PCs. The device supports data rates of 100, 200, and 400 Mb/s. Functions: 1. Link Layer Controller (LLC) functionality. 2. IEEE 1394a-2000 compliant physical layer. Applications: 1. Digital cameras. 2. Camcorders. 3. Set-top boxes. 4. Printers. 5. Audio/video equipment. Alternative Components: 1. Texas Instruments TSB41AB2IPFP. 2. Texas Instruments TSB41LV03APZEP. 3. LSI L-FW643E-2. 4. Agere FW643. 5. Via VT6315. Embedded Modules: No specific information is available regarding embedded modules in the TSB12LV01BIPZTEP. Related Q&A: 1. Q: What are the key features of the Texas Instruments TSB12LV01BIPZTEP? A: The key features include high performance, low power consumption, support for various data rates, and IEEE 1394a-2000 compliance. 2. Q: How does the TSB12LV01BIPZTEP benefit digital camera manufacturers? A: It offers a cost-effective and robust solution for connecting digital cameras to PCs, ensuring fast and reliable data transfer. 3. Q: Can the TSB12LV01BIPZTEP be used in automotive applications? A: While primarily designed for consumer electronics, with appropriate considerations for operating conditions, it can potentially be used in automotive applications. 4. Q: What are the advantages of using the Texas Instruments TSB12LV01BIPZTEP in set-top boxes? A: The device's integration of Link Layer Controller and PHY provides a compact solution, benefiting set-top box manufacturers seeking efficient connectivity options. 5. Q: Are there specific design considerations when integrating the TSB12LV01BIPZTEP in audio/video equipment? A: Designers should consider power management, data rate requirements, and compatibility with other components when integrating this IC in audio/video equipment.

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Delivering Time
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TSB12LV01BIPZTEP provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.