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Rochester Electronics TPS2206IDAP
Manufacturer # :TPS2206IDAP
Manufacturer :Rochester Electronics
Dasenic # :TPS2206IDAP-DS
Datasheet : TPS2206IDAP Datasheet
Customer # :
Description : IC PWR SWITCH 3:4 32HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10216
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.501
Total :$ 3.50
Delivery :
Payment :
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TPS2206IDAP information
Rochester Electronics TPS2206IDAP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Status Flag
- Mounting Type:Surface Mount
- Package / Case:32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Input Type:-
- Output Type:-
- Interface:Serial
- Supplier Device Package:32-HTSSOP
- Ratio - Input: Output:3:4
- Voltage - Supply ( Vcc/ Vdd):Not Required
- Number of Outputs:4
- Fault Protection:Current Limiting (Fixed), Over Temperature
- Output Configuration:High Side
- Rds On ( Typ):103mOhm
- Voltage - Load:3.3V, 5V, 12V
- Current - Output ( Max):1A
- Switch Type:PCMCIA Switch
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TPS2206IDAP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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