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Rochester Electronics TMS320F280270DAS
Manufacturer # :TMS320F280270DAS
Manufacturer :Rochester Electronics
Dasenic # :TMS320F280270DAS-DS
Datasheet : TMS320F280270DAS Datasheet
Customer # :
Description : IC MCU 32BIT 32KB FLASH 38TSSOP
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In Stock: 3840
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.556
Total :$ 2.56
Delivery :
Payment :
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TMS320F280270DAS information
Rochester Electronics TMS320F280270DAS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:38-TSSOP (0.240", 6.10mm Width)
- Supplier Device Package:38-TSSOP
- Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/ O:20
- Speed:50MHz
- E E P R O M Size:-
- Core Processor:C28x
- R A M Size:4K x 16
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:I²C, SCI, SPI, UART/USART
- Program Memory Size:32KB (16K x 16)
- Voltage - Supply ( Vcc/ Vdd):1.71V ~ 1.995V
- Data Converters:A/D 6x12b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMS320F280270DAS provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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