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Rochester Electronics TMS320DM355CZCE270
IC DGTL MEDIA SOC 337NFBGA
Manufacturer # :TMS320DM355CZCE270
Manufacturer :Rochester Electronics
Dasenic # :TMS320DM355CZCE270-DS
Datasheet :
TMS320DM355CZCE270 Datasheet
TMS320DM355CZCE270 DatasheetCustomer # :
Description : IC DGTL MEDIA SOC 337NFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 23.4450 | $ 23.45 |
| 25+ | $ 22.9770 | $ 574.43 |
| 100+ | $ 22.0410 | $ 2204.1 |
| 500+ | $ 21.1050 | $ 10552.5 |
| 1000+ | $ 19.9260 | $ 19926 |
In Stock: 53314
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 23.445
Total :$ 23.45
Delivery :
Payment :
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TMS320DM355CZCE270 information
Rochester Electronics TMS320DM355CZCE270 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:337-LFBGA
- Type:Digital Media System-on-Chip (DMSoC)
- Interface:ASP, I²C, SPI, UART, USB
- Supplier Device Package:337-BGA (13x13)
- Clock Rate:270MHz
- Non- Volatile Memory:ROM (8kB)
- On- Chip R A M:56kB
- Voltage - I/ O:1.8V, 3.3V
- Voltage - Core:1.30V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM355CZCE270 provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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