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Rochester Electronics TLV2324IPWLE
Manufacturer # :TLV2324IPWLE
Manufacturer :Rochester Electronics
Dasenic # :TLV2324IPWLE-DS
Datasheet : TLV2324IPWLE Datasheet
Customer # :
Description : IC CMOS 4 CIRCUIT 14TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7200
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6825
Total :$ 0.68
Delivery :
Payment :
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TLV2324IPWLE information
Rochester Electronics TLV2324IPWLE technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width)
- Current - Supply:39µA (x4 Channels)
- Output Type:-
- Supplier Device Package:14-TSSOP
- Number of Circuits:4
- Amplifier Type:CMOS
- -3db Bandwidth:-
- Current - Output / Channel:30 mA
- Slew Rate:0.03V/µs
- Gain Bandwidth Product:85 kHz
- Current - Input Bias:0.6 pA
- Voltage - Input Offset:1.1 mV
- Voltage - Supply Span ( Min):2 V
- Voltage - Supply Span ( Max):8 V
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV2324IPWLE provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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