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Rochester Electronics TAS5132DDV

IC AMP CLASS D STER 26W 44HTSSOP
part number has RoHS
Manufacturer # :TAS5132DDV
Manufacturer :Rochester Electronics
Dasenic # :TAS5132DDV-DS
Customer # :
Description : IC AMP CLASS D STER 26W 44HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.8430$ 3.84
25+$ 3.7620$ 94.05
100+$ 3.6090$ 360.9
500+$ 3.4560$ 1728
1000+$ 3.2670$ 3267
In Stock: 4494
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.843
Total :$ 3.84
Delivery :
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Payment :
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TAS5132DDV information

  • Rochester Electronics TAS5132DDV technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Features:Digital Inputs, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Package / Case:44-TSSOP (0.244", 6.20mm Width) Exposed Pad
  • Type:Class D
  • Output Type:2-Channel (Stereo)
  • Supplier Device Package:44-HTSSOP
  • Voltage - Supply:10.8V ~ 13.2V
  • Max Output Power x Channels @ Load:26W x 2 @ 6Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TAS5132DDV provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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