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Rochester Electronics SSR4N60BTF
Manufacturer # :SSR4N60BTF
Manufacturer :Rochester Electronics
Dasenic # :SSR4N60BTF-DS
Datasheet : SSR4N60BTF Datasheet
Customer # :
Description : N-CHANNEL POWER MOSFET
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3891
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1945
Total :$ 0.19
Delivery :
Payment :
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SSR4N60BTF information
Rochester Electronics SSR4N60BTF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:TO-252-3 (DPAK)
- Power Dissipation ( Max):2.5W (Ta), 49W (Tc)
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):600 V
- Current - Continuous Drain ( Id) @ 25° C:2.8A (Tc)
- Rds On ( Max) @ Id, Vgs:2.5Ohm @ 1.4A, 10V
- Vgs(th) ( Max) @ Id:4V @ 250µA
- Gate Charge ( Qg) ( Max) @ Vgs:29 nC @ 10 V
- Input Capacitance ( Ciss) ( Max) @ Vds:920 pF @ 25 V
- Drive Voltage ( Max Rds On, Min Rds On):10V
- Vgs ( Max):±30V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SSR4N60BTF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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