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1 : $1.7082
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Rochester Electronics SN74AS832BDW
IC GATE OR 6CH 2-INP 20SOIC
Manufacturer # :SN74AS832BDW
Manufacturer :Rochester Electronics
Dasenic # :SN74AS832BDW-DS
Datasheet :
SN74AS832BDW Datasheet
SN74AS832BDW DatasheetCustomer # :
Description : IC GATE OR 6CH 2-INP 20SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.7082 | $ 1.71 |
| 10+ | $ 1.6983 | $ 16.98 |
| 100+ | $ 1.6929 | $ 169.29 |
In Stock: 8046
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.7082
Total :$ 1.71
Delivery :
Payment :
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SN74AS832BDW information
Rochester Electronics SN74AS832BDW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Gates and Inverters
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package:20-SOIC
- Number of Circuits:6
- Voltage - Supply:4.5V ~ 5.5V
- Number of Inputs:2
- Current - Quiescent ( Max):-
- Logic Type:OR Gate
- Current - Output High, Low:48mA, 48mA
- Max Propagation Delay @ V, Max C L:6.3ns @ 5V, 50pF
- Logic Level - Low:0.8V
- Logic Level - High:2V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AS832BDW provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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