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1 : $0.2425
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Rochester Electronics SN74AHC157N
IC MULTIPLEXER 4 X 2:1 16DIP
Manufacturer # :SN74AHC157N
Manufacturer :Rochester Electronics
Dasenic # :SN74AHC157N-DS
Datasheet :
SN74AHC157N Datasheet
SN74AHC157N DatasheetCustomer # :
Description : IC MULTIPLEXER 4 X 2:1 16DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2425 | $ 0.24 |
| 25+ | $ 0.2376 | $ 5.94 |
| 100+ | $ 0.2279 | $ 22.79 |
| 500+ | $ 0.2183 | $ 109.15 |
| 1000+ | $ 0.2061 | $ 206.1 |
In Stock: 37470
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2425
Total :$ 0.24
Delivery :
Payment :
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SN74AHC157N information
Rochester Electronics SN74AHC157N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:16-DIP (0.300", 7.62mm)
- Type:Multiplexer
- Supplier Device Package:16-PDIP
- Voltage - Supply:2V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:8mA, 8mA
- Circuit:4 x 2:1
- Independent Circuits:1
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AHC157N provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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