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Rochester Electronics SN74ACT3632-30PQ
Manufacturer # :SN74ACT3632-30PQ
Manufacturer :Rochester Electronics
Dasenic # :SN74ACT3632-30PQ-DS
Datasheet : SN74ACT3632-30PQ Datasheet
Customer # :
Description : IC CLK DUAL FIFO MEMORY 132-QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1572
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.514
Total :$ 8.51
Delivery :
Payment :
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SN74ACT3632-30PQ information
Rochester Electronics SN74ACT3632-30PQ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:132-BQFP Bumpered
- Supplier Device Package:132-BQFP (24.54x24.54)
- Memory Size:36K (512 x 36 x 2)
- Voltage - Supply:4.5 V ~ 5.5 V
- Current - Supply ( Max):400µA
- Data Rate:33.4MHz
- Access Time:15ns
- Bus Directional:Bi-Directional
- Expansion Type:Width
- Programmable Flags Support:Yes
- Retransmit Capability:No
- F W F T Support:No
- Function:Synchronous
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:4 (72 Hours)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74ACT3632-30PQ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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