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Rochester Electronics SIGC100T60R3EX1SA1
Manufacturer # :SIGC100T60R3EX1SA1
Manufacturer :Rochester Electronics
Dasenic # :SIGC100T60R3EX1SA1-DS
Datasheet : SIGC100T60R3EX1SA1 Datasheet
Customer # :
Description : IGBT 3 CHIP 600V 200A WAFER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7913
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.637
Total :$ 11.64
Delivery :
Payment :
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SIGC100T60R3EX1SA1 information
Rochester Electronics SIGC100T60R3EX1SA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-40°C ~ 175°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:Die
- Input Type:Standard
- Power - Max:-
- Supplier Device Package:Die
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):200 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:Trench Field Stop
- Vce(on) ( Max) @ Vge, Ic:1.9V @ 15V, 200A
- Current - Collector Pulsed ( Icm):600 A
- Switching Energy:-
- Gate Charge:-
- Td (on/off) @ 25° C:-
- Test Condition:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- HTS US:0000.00.0000
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SIGC100T60R3EX1SA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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