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Rochester Electronics R1LV0408DSA-7LR#B0
Manufacturer # :R1LV0408DSA-7LR#B0
Manufacturer :Rochester Electronics
Dasenic # :R1LV0408DSA-7LR#B0-DS
Datasheet : R1LV0408DSA-7LR#B0 Datasheet
Customer # :
Description : IC SRAM 4MBIT PARALLEL 32STSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 17850
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 102.559
Total :$ 102.56
Delivery :
Payment :
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R1LV0408DSA-7LR#B0 information
Rochester Electronics R1LV0408DSA-7LR#B0 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-TFSOP (0.465", 11.80mm Width)
- Technology:SRAM
- Supplier Device Package:32-TSOP I
- Memory Size:4Mb (512K x 8)
- Memory Type:Volatile
- Voltage - Supply:2.7V ~ 3.6V
- Clock Frequency:-
- Access Time:70 ns
- Memory Format:SRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:70ns
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
R1LV0408DSA-7LR#B0 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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