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1 : $0.2430
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Rochester Electronics QS3VH16210PA
HIGH BANDWIDTH BUS SWITCH
Manufacturer # :QS3VH16210PA
Manufacturer :Rochester Electronics
Dasenic # :QS3VH16210PA-DS
Datasheet :
QS3VH16210PA Datasheet
QS3VH16210PA DatasheetCustomer # :
Description : HIGH BANDWIDTH BUS SWITCH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2430 | $ 0.24 |
| 10+ | $ 0.2333 | $ 2.33 |
| 100+ | $ 0.2187 | $ 21.87 |
| 1000+ | $ 0.2163 | $ 216.3 |
| 10000+ | $ 0.2138 | $ 2138 |
In Stock: 13981
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.243
Total :$ 0.24
Delivery :
Payment :
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QS3VH16210PA information
Rochester Electronics QS3VH16210PA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:48-TFSOP (0.240", 6.10mm Width)
- Type:Bus Switch
- Supplier Device Package:48-TSSOP
- Voltage - Supply:3V ~ 3.6V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:-
- Circuit:10 x 1:1
- Independent Circuits:2
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
QS3VH16210PA provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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