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Rochester Electronics NGTB30N60IHLWG
Manufacturer # :NGTB30N60IHLWG
Manufacturer :Rochester Electronics
Dasenic # :NGTB30N60IHLWG-DS
Datasheet : NGTB30N60IHLWG Datasheet
Customer # :
Description : IGBT 600V 30A TO247
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6840
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.133
Total :$ 2.13
Delivery :
Payment :
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NGTB30N60IHLWG information
Rochester Electronics NGTB30N60IHLWG technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Input Type:Standard
- Power - Max:250 W
- Supplier Device Package:TO-247-3
- Reverse Recovery Time (trr):400 ns
- Current - Collector ( Ic) ( Max):60 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:Trench Field Stop
- Vce(on) ( Max) @ Vge, Ic:2.3V @ 15V, 30A
- Current - Collector Pulsed ( Icm):150 A
- Switching Energy:280µJ (off)
- Gate Charge:130 nC
- Td (on/off) @ 25° C:70ns/140ns
- Test Condition:400V, 30A, 10Ohm, 15V
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NGTB30N60IHLWG provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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