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Rochester Electronics MK20DX256VMD10
Manufacturer # :MK20DX256VMD10
Manufacturer :Rochester Electronics
Dasenic # :MK20DX256VMD10-DS
Datasheet : MK20DX256VMD10 Datasheet
Customer # :
Description : IC MCU 32B 256KB FLASH 144MAPBGA
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In Stock: 4800
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.4309
Total :$ 11.43
Delivery :
Payment :
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MK20DX256VMD10 information
Rochester Electronics MK20DX256VMD10 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:144-LBGA
- Supplier Device Package:144-MAPBGA (13x13)
- Peripherals:DMA, I²S, LVD, POR, PWM, WDT
- Number of I/ O:100
- Speed:100MHz
- E E P R O M Size:4K x 8
- Core Processor:ARM® Cortex®-M4
- R A M Size:64K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Program Memory Size:256KB (256K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.71V ~ 3.6V
- Data Converters:A/D 42x16b; D/A 2x12b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MK20DX256VMD10 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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