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Rochester Electronics MCF5485CZP200557

RISC MICROPROCESSOR, 32 BIT, COL
part number has RoHS
Manufacturer # :MCF5485CZP200557
Manufacturer :Rochester Electronics
Dasenic # :MCF5485CZP200557-DS
Customer # :
Description : RISC MICROPROCESSOR, 32 BIT, COL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9000$ 0.9
10+$ 0.9000$ 9
100+$ 0.9000$ 90
1000+$ 0.9000$ 900
In Stock: 7500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9
Total :$ 0.90
Delivery :
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Payment :
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MCF5485CZP200557 information

  • Rochester Electronics MCF5485CZP200557 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Package / Case:388-BBGA
  • Supplier Device Package:388-PBGA (27x27)
  • Voltage - I/ O:1.5V
  • Speed:200MHz
  • Core Processor:Coldfire V4E
  • Number of Cores/ Bus Width:1 Core, 32-Bit
  • Co- Processors/ D S P:-
  • R A M Controllers:SDRAM
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:-
  • Ethernet:10/100Mbps (2)
  • S A T A:-
  • U S B:USB 2.0 + PHY (1)
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MCF5485CZP200557 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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