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Rochester Electronics MCF5270CVM150
Manufacturer # :MCF5270CVM150
Manufacturer :Rochester Electronics
Dasenic # :MCF5270CVM150-DS
Datasheet : MCF5270CVM150 Datasheet
Customer # :
Description : IC MCU 32BIT ROMLESS 196MAPBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 13418
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 21.3732
Total :$ 21.37
Delivery :
Payment :
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MCF5270CVM150 information
Rochester Electronics MCF5270CVM150 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:196-LBGA
- Supplier Device Package:196-LBGA (15x15)
- Peripherals:DMA, WDT
- Number of I/ O:97
- Speed:150MHz
- E E P R O M Size:-
- Core Processor:Coldfire V2
- R A M Size:64K x 8
- Program Memory Type:ROMless
- Core Size:32-Bit Single-Core
- Connectivity:EBI/EMI, Ethernet, I²C, SPI, UART/USART
- Program Memory Size:-
- Voltage - Supply ( Vcc/ Vdd):1.4V ~ 1.6V
- Data Converters:-
- Oscillator Type:External
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MCF5270CVM150 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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