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Rochester Electronics MC74HC1G00DFT2

IC GATE NAND 1CH 2-INP SC-70
part number has RoHS
Manufacturer # :MC74HC1G00DFT2
Manufacturer :Rochester Electronics
Dasenic # :MC74HC1G00DFT2-DS
Customer # :
Description : IC GATE NAND 1CH 2-INP SC-70
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0090$ 0.01
10+$ 0.0090$ 0.09
100+$ 0.0090$ 0.9
500+$ 0.0090$ 4.5
1000+$ 0.0090$ 9
In Stock: 53780
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
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MC74HC1G00DFT2 information

  • Rochester Electronics MC74HC1G00DFT2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:5-TSSOP, SC-70-5, SOT-353
  • Supplier Device Package:SC-88A (SC-70-5/SOT-353)
  • Number of Circuits:1
  • Voltage - Supply:2V ~ 6V
  • Number of Inputs:2
  • Current - Quiescent ( Max):1 µA
  • Logic Type:NAND Gate
  • Current - Output High, Low:2.6mA, 2.6mA
  • Max Propagation Delay @ V, Max C L:17ns @ 6V, 50pF
  • Logic Level - Low:0.5V ~ 1.8V
  • Logic Level - High:1.5V ~ 4.2V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74HC1G00DFT2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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