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1 : $2.8080
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Rochester Electronics MC10EL04DTG
IC GATE AND/NAND ECL 2INP 8TSSOP
Manufacturer # :MC10EL04DTG
Manufacturer :Rochester Electronics
Dasenic # :MC10EL04DTG-DS
Datasheet :
MC10EL04DTG Datasheet
MC10EL04DTG DatasheetCustomer # :
Description : IC GATE AND/NAND ECL 2INP 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.8080 | $ 2.81 |
| 25+ | $ 2.7540 | $ 68.85 |
| 100+ | $ 2.6370 | $ 263.7 |
| 500+ | $ 2.5290 | $ 1264.5 |
| 1000+ | $ 2.3850 | $ 2385 |
In Stock: 11083
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.808
Total :$ 2.81
Delivery :
Payment :
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MC10EL04DTG information
Rochester Electronics MC10EL04DTG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Gates and Inverters
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Output Type:Differential
- Supplier Device Package:8-TSSOP
- Number of Circuits:1
- Voltage - Supply:4.2V ~ 5.7V
- Number of Inputs:2
- Logic Type:AND/NAND Gate
- Current - Output High, Low:-
- Schmitt Trigger Input:No
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC10EL04DTG provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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