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1 : $4.8960
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Rochester Electronics MAX802TEPA+
IC SUPERVISOR 1 CHANNEL 8DIP
Manufacturer # :MAX802TEPA+
Manufacturer :Rochester Electronics
Dasenic # :MAX802TEPA+-DS
Datasheet :
MAX802TEPA+ Datasheet
MAX802TEPA+ DatasheetCustomer # :
Description : IC SUPERVISOR 1 CHANNEL 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 4.8960 | $ 4.9 |
| 25+ | $ 4.7970 | $ 119.93 |
| 100+ | $ 4.5990 | $ 459.9 |
| 500+ | $ 4.4100 | $ 2205 |
| 1000+ | $ 4.1580 | $ 4158 |
In Stock: 3234
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.896
Total :$ 4.90
Delivery :
Payment :
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MAX802TEPA+ information
Rochester Electronics MAX802TEPA+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Supervisors
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Type:Battery Backup Circuit
- Supplier Device Package:8-PDIP
- Output:Push-Pull, Totem Pole
- Reset:Active Low
- Number of Voltages Monitored:1
- Voltage - Threshold:3.075V
- Reset Timeout:140ms Minimum
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:OBSOLETE
- HTS US:0000.00.0000
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX802TEPA+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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