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Rochester Electronics MAX2391ETI+

RF RX W-CDMA 2.11-2.17GHZ 28QFN
part number has RoHS
Manufacturer # :MAX2391ETI+
Manufacturer :Rochester Electronics
Dasenic # :MAX2391ETI+-DS
Customer # :
Description : RF RX W-CDMA 2.11-2.17GHZ 28QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.3820$ 5.38
25+$ 5.2740$ 131.85
100+$ 5.0580$ 505.8
500+$ 4.8420$ 2421
1000+$ 4.5720$ 4572
In Stock: 6798
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.382
Total :$ 5.38
Delivery :
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Payment :
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MAX2391ETI+ information

  • Rochester Electronics MAX2391ETI+ technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Receivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:28-WFQFN Exposed Pad
  • Frequency:2.11GHz ~ 2.17GHz
  • Sensitivity:-
  • Supplier Device Package:28-TQFN (5x5)
  • Data Rate ( Max):3.84Mcps
  • Memory Size:-
  • Voltage - Supply:2.7V ~ 3.3V
  • Data Interface:PCB, Surface Mount
  • Modulation or Protocol:W-CDMA
  • Current - Receiving:40mA
  • Antenna Connector:PCB, Surface Mount
  • Applications:UMTS
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MAX2391ETI+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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