Name: LV24230LP-S-TLM-E-ON
Brand: Rochester Electronics
SKU: DS-8573287
Price: 4.06 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Rochester Electronics LV24230LP-S-TLM-E-ON

1-CHIP FM TUNER IC COMPACT PORTA

Manufacturer # :LV24230LP-S-TLM-E-ON

Manufacturer :Rochester Electronics

Dasenic # :LV24230LP-S-TLM-E-ON-DS

Datasheet :

LV24230LP-S-TLM-E-ON Datasheet

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Description : 1-CHIP FM TUNER IC COMPACT PORTA

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
148+	$ 4.0600	$ 600.88

In Stock: 1055

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 4.06

Total :$ 4.06

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LV24230LP-S-TLM-E-ON information

Rochester Electronics LV24230LP-S-TLM-E-ON technical specifications, attributes, parameters.
Category:RF and Wireless/RF Misc ICs and Modules
Product Status:Active
Mounting Type:-
Package / Case:-
Frequency:-
Supplier Device Package:-
R F Type:-
Secondary Attributes:-
Function:-
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Rochester Electronics LV24230LP-S-TLM-E-ON
Datasheet:
LV24230LP-S-TLM-E-ON,

Rochester Electronics LV24230LP-S-TLM-E-ON Environmental and export classification status description
The OnsemiLV24230LP-S-TLM-E-ON is a compact RF and Wireless module designed for various wireless applications. It offers a range of features and functionalities that make it suitable for use in a wide range of projects. Functions: - The module can be used for wireless communication. - It offers reliable and low-power connectivity. - Supports various wireless protocols and standards. Applications: - IoT (Internet of Things) devices. - Home automation systems. - Industrial control systems. - Smart sensor networks. - Wearable technology. Alternative Components: - Nordic Semiconductor nRF24L01+ - Texas Instruments CC2530 - ESP8266 Embedded Modules: - Bluetooth Low Energy (BLE) module - Wi-Fi module - Zigbee module 3 to 5 Related Q&A: 1. Q: What is the maximum range of communication supported by the OnsemiLV24230LP-S-TLM-E-ON module? A: The module can support communication over a range of up to 100 meters, depending on the environmental conditions. 2. Q: Can the module be easily integrated into existing IoT devices? A: Yes, the OnsemiLV24230LP-S-TLM-E-ON module is designed for easy integration into various IoT devices and systems. 3. Q: What kind of power requirements does the module have? A: The module is designed to operate on low power, making it suitable for battery-operated devices and applications. 4. Q: Is the OnsemiLV24230LP-S-TLM-E-ON module compatible with different wireless protocols? A: Yes, the module supports various wireless protocols, which makes it versatile for different applications. 5. Q: Can the module connect to smartphones and tablets for data exchange? A: The OnsemiLV24230LP-S-TLM-E-ON module can be integrated with devices such as smartphones and tablets for data exchange and control functionalities.

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

LV24230LP-S-TLM-E-ON provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.