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Rochester Electronics LM3S1P51-IBZ80-C5
Manufacturer # :LM3S1P51-IBZ80-C5
Manufacturer :Rochester Electronics
Dasenic # :LM3S1P51-IBZ80-C5-DS
Datasheet : LM3S1P51-IBZ80-C5 Datasheet
Customer # :
Description : IC MCU 32BIT 64KB FLASH 108BGA
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In Stock: 1868
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.936
Total :$ 9.94
Delivery :
Payment :
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LM3S1P51-IBZ80-C5 information
Rochester Electronics LM3S1P51-IBZ80-C5 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:108-LFBGA
- Supplier Device Package:108-BGA (10x10)
- Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Number of I/ O:67
- Speed:80MHz
- E E P R O M Size:-
- Core Processor:ARM® Cortex®-M3
- R A M Size:24K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Program Memory Size:64KB (64K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.08V ~ 3.6V
- Data Converters:A/D 16x10b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM3S1P51-IBZ80-C5 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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