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1 : $277.1820
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Rochester Electronics LFX500B-04FN900C
FPGA, 1764 CLBS, 476000 GATES
Manufacturer # :LFX500B-04FN900C
Manufacturer :Rochester Electronics
Dasenic # :LFX500B-04FN900C-DS
Datasheet :
LFX500B-04FN900C Datasheet
LFX500B-04FN900C DatasheetCustomer # :
Description : FPGA, 1764 CLBS, 476000 GATES
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 277.1820 | $ 277.18 |
| 25+ | $ 271.6380 | $ 6790.95 |
| 100+ | $ 260.5500 | $ 26055 |
| 500+ | $ 249.4620 | $ 124731 |
| 1000+ | $ 235.6020 | $ 235602 |
In Stock: 1531
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 277.182
Total :$ 277.18
Delivery :
Payment :
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LFX500B-04FN900C information
Rochester Electronics LFX500B-04FN900C technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:-
- Supplier Device Package:-
- Voltage - Supply:-
- Number of I/ O:-
- Number of L A Bs/ C L Bs:1764
- Number of Logic Elements/ Cells:-
- Number of gates:476000
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LFX500B-04FN900C provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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