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Rochester Electronics LC87F5VP6AU-QIP-H
Manufacturer # :LC87F5VP6AU-QIP-H
Manufacturer :Rochester Electronics
Dasenic # :LC87F5VP6AU-QIP-H-DS
Datasheet : LC87F5VP6AU-QIP-H Datasheet
Customer # :
Description : IC MCU 8BIT 256KB FLASH 100QIPE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3750
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.15
Total :$ 3.15
Delivery :
Payment :
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LC87F5VP6AU-QIP-H information
Rochester Electronics LC87F5VP6AU-QIP-H technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-BQFP
- Supplier Device Package:100-PQFP (14x20)
- Peripherals:PWM, WDT
- Number of I/ O:88
- Speed:15MHz
- E E P R O M Size:-
- Core Processor:-
- R A M Size:10K x 8
- Program Memory Type:Flash
- Core Size:8-Bit
- Connectivity:SIO, UART/USART
- Program Memory Size:256KB (256K x 8)
- Voltage - Supply ( Vcc/ Vdd):2.5V ~ 5.5V
- Data Converters:A/D 15x8b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:4 (72 Hours)
- REACH Status:REACH Unaffected
- US ECCN:OBSOLETE
- HTS US:0000.00.0000
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LC87F5VP6AU-QIP-H provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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