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Rochester Electronics LB11870-MPB-E
Manufacturer # :LB11870-MPB-E
Manufacturer :Rochester Electronics
Dasenic # :LB11870-MPB-E-DS
Datasheet : LB11870-MPB-E Datasheet
Customer # :
Description : IC MOTOR DRIVER 9.5V-28V 48HSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1397
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.7
Total :$ 4.70
Delivery :
Payment :
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LB11870-MPB-E information
Rochester Electronics LB11870-MPB-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Obsolete
- Operating Temperature:-20°C ~ 80°C (TA)
- Mounting Type:Surface Mount
- Package / Case:48-SSOP (0.311", 7.90mm Width) Exposed Pad + 2 Heat Tabs
- Technology:Bipolar
- Interface:PWM
- Supplier Device Package:48-HSSOP
- Voltage - Supply:9.5V ~ 28V
- Current - Output:2.3A
- Output Configuration:Half Bridge (3)
- Voltage - Load:9.5V ~ 28V
- Motor Type - Stepper:-
- Motor Type - A C, D C:Brushless DC (BLDC)
- Step Resolution:-
- Applications:Polygonal Mirror
- Function:Driver - Fully Integrated, Control and Power Stage
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LB11870-MPB-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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