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1 : $2250.0900
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Rochester Electronics KAI-11002-ABA-CD-B2
IMAGE SENSOR CCD 10.7MP 40CDIP
Manufacturer # :KAI-11002-ABA-CD-B2
Manufacturer :Rochester Electronics
Dasenic # :KAI-11002-ABA-CD-B2-DS
Datasheet :
KAI-11002-ABA-CD-B2 Datasheet
KAI-11002-ABA-CD-B2 DatasheetCustomer # :
Description : IMAGE SENSOR CCD 10.7MP 40CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2250.0900 | $ 2250.09 |
| 25+ | $ 2205.0900 | $ 55127.25 |
| 100+ | $ 2115.0810 | $ 211508.1 |
| 500+ | $ 2025.0810 | $ 1012540.5 |
| 1000+ | $ 1912.5810 | $ 1912581 |
In Stock: 1908
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2250.09
Total :$ 2250.09
Delivery :
Payment :
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KAI-11002-ABA-CD-B2 information
Rochester Electronics KAI-11002-ABA-CD-B2 technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Obsolete
- Operating Temperature:-50°C ~ 70°C (TA)
- Package / Case:40-CDIP Module
- Type:CCD
- Supplier Device Package:40-CDIP
- Voltage - Supply:14.5V ~ 15.5V
- Frames per Second:3
- Pixel Size:9µm x 9µm
- Active Pixel Array:4008H x 2672V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
KAI-11002-ABA-CD-B2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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