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Rochester Electronics IKP15N65F5XKSA1

IGBT 650V 30A TO220-3
part number has RoHS
Manufacturer # :IKP15N65F5XKSA1
Manufacturer :Rochester Electronics
Dasenic # :IKP15N65F5XKSA1-DS
Customer # :
Description : IGBT 650V 30A TO220-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.8154$ 0.82
In Stock: 15600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.8154
Total :$ 0.82
Delivery :
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  • Rochester Electronics IKP15N65F5XKSA1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Input Type:Standard
  • Power - Max:105 W
  • Supplier Device Package:PG-TO220-3
  • Reverse Recovery Time (trr):50 ns
  • Current - Collector ( Ic) ( Max):30 A
  • Voltage - Collector Emitter Breakdown ( Max):650 V
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:2.1V @ 15V, 15A
  • Current - Collector Pulsed ( Icm):45 A
  • Switching Energy:130µJ (on), 40µJ (off)
  • Gate Charge:38 nC
  • Td (on/off) @ 25° C:17ns/150ns
  • Test Condition:400V, 7.5A, 39Ohm, 15V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
IKP15N65F5XKSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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