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1 : $9.1530
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Rochester Electronics HM1-6551-9
256 X 4 CMOS RAM
Manufacturer # :HM1-6551-9
Manufacturer :Rochester Electronics
Dasenic # :HM1-6551-9-DS
Datasheet :
HM1-6551-9 Datasheet
HM1-6551-9 DatasheetCustomer # :
Description : 256 X 4 CMOS RAM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 9.1530 | $ 9.15 |
| 25+ | $ 8.9730 | $ 224.33 |
| 100+ | $ 8.6040 | $ 860.4 |
| 500+ | $ 8.2350 | $ 4117.5 |
| 1000+ | $ 7.7760 | $ 7776 |
In Stock: 5040
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.153
Total :$ 9.15
Delivery :
Payment :
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HM1-6551-9 information
Rochester Electronics HM1-6551-9 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Through Hole
- Package / Case:22-CDIP (0.400", 10.16mm)
- Technology:SRAM - Asynchronous
- Supplier Device Package:22-CDIP
- Memory Size:1Kb (256 x 4)
- Memory Type:Volatile
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:-
- Access Time:300 ns
- Memory Format:SRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:400ns
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HM1-6551-9 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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